Advanced Manufacturing Technologies

Surface Mount Technology

As surface mount manufacturing increases in complexity, we recognize that accurate printing of boards, precise placement, and soldering of components are paramount for a quality finish. In this context, we have invested in the appropriate surface mount equipment to meet our clients' current and future requirements. This includes equipment for correct lead-free assembly processes for customers that require quality RoHS product compliance.

EKRA Automatic Fine-Pitch Printers (2) with visual inspection system.
SAMSUNG CP40 Series Fully Automatic Pick-and-Place machinery (3) with vision systems.
ERSA Hotflow 5-03 Convection Re-Flow Oven with ERSA temperature Profiler.
JT SS800 convection reflow oven suited to RoHS assembly processes.
WELLER Surface Mount rework station.
Three-Dimensional Microscope inspection equipment.

Wave Soldering

For traditional lead(Pb)-based wave soldering we employ a ERSA ETS 330 Through-Hole-and-Surface-Mount Wave Soldering machine to improve time efficiencies, as surface-mount devices and through-hole components can be soldered simultaneously. This machine uses a compressed air flux spraying system which eliminates the conventional cleaning process. This prevents damage to components whilst being friendly to the environment at the same time. For Lead(Pb)- free RoHS compliant wave soldering we use a JT SM-450 wave solder machine with additional heating and cooling controls to achieve correct solder joints vital for this process.

Mechanical Assembly

We offer services that include looming, printed circuit board assembly, and metalwork assembly. The finished products are then tested for compliance to quality standards.