Excess heat can be an issue for the optimal functioning of your PCB. So, you’d want it to have heat-dissipating properties and safeguard the board from performance issues or total breakdowns.
Why Is Heat A Problem?
When current flows through the PCB’s electrical components, it adds to the thermal load. This is especially true for parts that have high power needs. But, depending upon the design of the circuit, its power, and the device characteristics, the amount of heat produced can vary.
Often, improperly mounted components and inadequate ventilation cause the print circuit board to overheat. Thermal issues can also arise when manufacturing the board.
Although high-quality boards can resist some heat, high temperatures can often disrupt the circuit lines, cause oxidation, separate the solder, and burn metal traces. In addition, being exposed to too much heat for a prolonged period can cause PCB malfunction beyond repair.
Therefore, there must be a strong focus on heat dissipation right from the beginning of the process.
Dissipating Heat in PCBs
Now that you know why heat can be problematic, here are some ways to help you manage heat flow and protect the structural integrity of your print circuit boards.
Technique #1. Identify Thermal Hotspots
It is a crucial step to pinpoint the potential hotspots within the PCB. Once you determine the areas that generate a lot of heat, re-route those traces away from the thermally sensitive components for optimal functioning.
Technique #2. Review Pad Design
PCB pads must have an adequate thickness for better heat management across a more extensive area. You could also mount heat sinks at the bottom layer for a streamlined heat transfer. Also, the solder paste must be in just the right amount so that the components don’t float on molten solder during reflow.
Technique #3. Careful Placement of the Components
This is particularly needed for high-power components and at the earliest phases as they’re the primary heat source and must be positioned in the centre for an even flow. If the parts are placed towards the edge, heat can be localised to specific areas and damage other components. So, the component arrangement must be even across the board.
Technique #4. Utilise Thermal Vias
Thermal vias drive heat through the copper barrels between the top and bottom levels. The vias act as a channel, transferring heat to the heat sink and passing it over to a cooling medium.
Technique #5. Heat Sinks for Thermal Management
For those intricate PCB designs, heat sinks are a go-to solution. These transfer heat from a high thermal resistance area to a low thermal resistance location. But make sure you choose the heat sink that matches your particular PCB design.
Technique #6. Integrate Cooling Fans
Sometimes you must integrate cooling fans within the design to manage high temperatures. It’s an efficient, convective heat transfer method to get the heat away from sensitive parts. Also, when choosing a cooling fan, consider the fan size, fan friction, operational costs, and power demands to get the correct fan.
Technique #7. Solder Thickness
Solder evenly within the joints and carefully near the vias to avoid interrupting the link between the PCB and the heat sink. This is one of the most crucial yet straightforward methods to manage heat when designing and manufacturing a print circuit board.
The Bottom Line
With the above techniques in mind, you shall be able to make sure that heat dissipates evenly and it doesn’t keep the PCB from functioning optimally. If you are looking for an advanced technology PCB partner, the team at ATMWA is a one-stop solution for quality PCB manufacturing and assembly. Feel free to contact us and discuss your PCB project.
