The upcoming arrival of the Seamark X5600 X-ray system will significantly elevate AT&M’s inspection capability, strengthening quality assurance, reliability, and compliance for complex PCB assemblies across critical industries.
AT&M is proud to announce the pending arrival of the Seamark X5600 X-ray inspection machine, due to be installed in March 2026. This new system reaffirms our commitment to investing in world-class technology and providing clients with unmatched quality, traceability, and reliability in every PCB assembly.
As PCB designs continue to increase in density and complexity, inspection capability must evolve alongside manufacturing precision. The Seamark X5600 represents a major step forward in ensuring that every assembly leaving our facility meets the highest possible quality standards.
Why Advanced X-Ray Inspection Matters in Modern PCB Assembly
Modern PCB assemblies often contain hidden solder joints, multilayer boards, fine-pitch components, and BGA packages that cannot be fully evaluated using standard optical inspection alone.
In high-reliability industries such as medical devices, aerospace, defence, mining, and industrial automation, even microscopic internal defects can compromise performance or long-term durability. Voids within solder joints, bridging, internal cracks, and misalignment are often invisible to traditional inspection methods.
Advanced microfocus X-ray inspection provides a non-destructive method of viewing these internal structures in detail. This allows AT&M to detect potential issues before products move to the next stage of production — or into the field — significantly reducing risk, rework, and warranty exposure.
What is the Seamark X5600?
The Seamark X5600 is a microfocus X-ray system designed for precise, non-destructive inspection of small parts such as electronic components. Its high-resolution imaging capabilities make it ideal for analysing defects in BGA solder joints, IC chips, and other complex packages without damaging the assembly.
The system operates using a sealed microfocus X-ray tube, delivering fine spot size resolution that enables highly detailed imaging of internal solder structures and component connections. This level of precision supports both routine quality inspection and advanced failure analysis.
Key Features of the Seamark X5600
Automatic Void Ratio Calculation: Ideal for advanced BGA inspection, the machine automatically identifies and inspects solder balls to measure void percentages and ensure process consistency.
Integrated Measurement Tools: Distance, angle, radius, and geometric measurement functions allow detailed dimensional analysis directly within the inspection software.
CNC Automated Operation: Programmed multi-point inspection routines enable consistent, repeatable analysis across batches, with automatic image capture and report generation.
Tilt and 360° Rotate Imaging: Multi-angle observation allows inspectors to examine components from different perspectives, eliminating blind spots and improving defect identification accuracy.
Customisable Image Algorithms: Advanced software can be tailored to detect specific defect types such as cracks, broken wires, bridging, misalignment, and offset components.
What This Means for AT&M Clients
With the integration of the X5600 into our inspection workflow, AT&M customers can expect measurable improvements in both quality control and production confidence.
Benefits include:
– Greater reliability for complex assemblies including BGA and microelectronics
– Earlier detection of hidden solder defects
– Faster root-cause failure analysis and process validation
– Improved first-pass yield and reduced rework
– Stronger documentation and traceability for regulated industries
For compliance-driven sectors, enhanced X-ray capability supports quality system requirements and provides additional assurance during audits and customer validation processes.
Investing in the Future of Australian Electronics Manufacturing
The addition of the Seamark X5600 reflects AT&M’s broader strategy of strengthening Australia’s advanced electronics manufacturing capability. Rather than relying on offshore inspection or limited testing methods, we continue to invest in in-house technology that ensures control, speed, and precision.
As component sizes shrink and performance expectations increase, inspection standards must rise accordingly. This investment positions AT&M as a technology-driven partner, capable of supporting next-generation electronic designs with confidence.
By combining advanced X-ray inspection with our established expertise in surface mount and through-hole assembly, AT&M continues to set a benchmark for quality-focused PCB manufacturing in Australia.
Connect with AT&M
The Seamark X5600 is more than just a new piece of equipment — it is a demonstration of AT&M’s commitment to continuous improvement, innovation, and leadership within the electronics assembly industry.
Get in touch with our team to find out how our enhanced inspection capabilities can support your next project — from prototype validation to full-scale production.
